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Combined database underpins 3DIC design suite
Cadence Design Systems has built a unified database to support a group of tools to support the planning and implementation of 3DIC system-in-package (SIP) designs with a focus on high-end computing and...
View ArticleDigitalization beyond the enterprise
How well companies extend digitalization strategies outside the enterprise will be critical to achieving greater efficiency, higher quality and faster time-to-market. A new technical paper reviews what...
View ArticleArm SystemReady adjusts to compatibility issues
Arm’s SystemReady program has revealed a number of the subtleties involved when trying to maintain software compatibility with operating systems without moving to the straightjacket of platforms like...
View ArticleChiplets may have to prove themselves for secure operation
How much can you trust the chiplets inside a multichip package? Not nearly as much you would like, explained University of Florida professor Mark Tehranipoor in an online seminar organized by packaging...
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Flexible hybrid electronics: Making an emerging tech happen with PDKs and...
The flexible hybrid electronics (FHE) sector is now moving towards much greater maturity. A recently published technical article and accompanying video discuss the latest advances, notably the...
View ArticleAMD moves gradually into 3D integration
At the recent Design Automation Conference, back in San Francisco with a hybrid format, AMD senior vice president Sam Naffziger provided more insights into the chipmaker’s use of chiplet-based design...
View ArticleLearn strategies for better measurement and test in simulation-based PCB design
Design engineers working on high-speed PCB projects want to use more simulation techniques, and then move efficiently through prototyping, measurement and delivery. A new white paper describes a...
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Teledyne pushes for optical for remote RF heads
Teledyne e2v has demonstrated a prototype optical link that the company believes could replace the conventional electrical signaling currently used to relay the output from a remote A/D converter to...
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Chipletz pushes packaging design for AI, HPC and immersive use-cases
Austin-based start-up Chipletz has completed its first design of a Smart Substrate that aims to help deliver the increasing performance needed for artificial intelligence (AI), high-performance...
View ArticleIdentifying AI opportunities in PCB design
Artificial intelligence (AI) continues to confuse even many within technology in part because the term itself is woolly but also because we are only just beginning to clarify its application across...
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